VibroGo is a portable digital laser doppler vibrometer, which can be battery powered for use in-the-field and on-the-go. It enables non-contact measurement of vibrational displacement, velocity and acceleration over a wide frequency range and at distances up to 30 m.
The Industrial Vibration Sensor (IVS-500) is the ideal tool for rapid, non-contact vibro-acoustic quality inspection, structure-borne noise analysis and reliable pass-fail decisions. Its robust and compact design means you can readily integrate it into process control systems and production environments with very short cycle times.
With the modular laser vibrometer VibroFlex, Polytec introduces a new level of flexibility in optical vibration measurement with a modular sensor solution (comprising separate console and sensor heads) that adapts to needs of the user. The VibroFlex allows users to investigate acoustic and vibration phenomena in both research and product development environments, for faster time-to-market. With the new QTec multi-path detection scheme, VibroFlex can now measure vibration characteristics across a diversity of difficult to measure surfaces.
VibroOne is the one-box solution for non-contact vibration measurement. It is specifically designed for use in close confines, and for the examination of small structures such as densely packed printed circuit boards and biomedical probes. The optional inline HD+ camera aids in precise positioning of the laser and provides imagery as required in test documentation.
PSV Qtec Scanning Vibrometer
PSV QTec Scanning Vibrometers take full-field vibration mapping to the next level with unrivalled optical sensitivity. Innovative, patented QTec technology uses multi-path interferometry and an infrared laser to produce high-fidelity measurements on a diverse range of surface types. PSV QTec significantly reduces testing time – especially on dark, biological, and rotating or moving objects. These systems are the ideal tools for determining operational deflection shapes and Eigenmodes for NVH, acoustics, structural dynamics, ultrasonics, FEM validation and NDT.
PSV-500 Scanning Vibrometer
The PSV-500 Scanning Vibrometer measures out-of-plane vibrations across an entire surface in a completely non-contact fashion. A He-Ne laser provides outstanding signal-to-noise ratio on reflective sample surfaces and is ideal for small samples and samples which are under water. This flexible measurement platform allows researchers and developers to detect and visualise operational deflection shapes and Eigenmodes of their structures and overcome challenging vibration measurement tasks with ease. The system can be upgraded/expanded for full-field (in-plane and out-of-plane) measurements as the users demands and requirements evolve.
MSA-060 Micro System Analyser
he MSA-060 Micro System Analyser is a compact optical measurement system for the comprehensive assessment of the vibrational behaviour of MEMS and microsystems, dynamics of precision mechanics and reliability of electronics. This entry-level full-field, non-contact vibration analysis solution identifies resonance frequencies, vibration amplitudes and can be used to visualise operational deflection shapes on entire samples.
MSA-650 IRIS Micro System Analyser
The innovative and patented MSA-650 IRIS Micro System Analyser utilises infrared illumination and an infrared measurement laser, to perform non-contact measurement of MEMS device dynamics (both in-plane and out-of-plane) through silicon top-caps, without the need for de-capping of the device.
MSA-600 Micro System Analyser
The MSA-600 is an all-in-one optical measurement solution for both static and dynamic 3D characterisation of MEMS and microstructures with support for frequencies up to 6 GHz. The MSA-600 enhances microsystem development and quality inspection, and is compatible with wafer-level testing when integrated into commercially available probe stations.
MSA-100-3D Micro System Analyser
The 3D Micro System Analyser enables the simultaneous measurement of vibration components of micro-scale devices (such as MEMS) in all three spatial directions. The system facilitates high-resolution 3D vibration analysis with amplitude resolutions in the sub-picometer range, for both in-plane and out-of-plane vibration components.